Kadco Specializes in Diamond Machining and Milling
Kadco Ceramics specializes in four areas of diamond machining: milling, grinding, ID slicing and dicing. All of these utilize state of the art CNC equipment guided by the expertise of our professional machining staff. Our diamond milling and grinding departments, illustrated by our logo, perform primarily diamond machining on a wide range of difficult materials. This includes challenging combinations such as copper traces on ceramic substrates and tight tolerances on the radius of curvature for piezoceramic lenses.
ID (internal diameter) slicing is frequently a cost effective solution for preparing large quantities of very thin components. We are always looking to extend our experience in ID slicing to unusual materials. We have had recent experience with thin sections of pyrolytic graphite, ferrites, piezoceramics, and Macor.
Our dicing experience includes not only singulation of silicon wafers but operations such as creating grooves in ceramics and minimizing burrs on plated electronic components. If our engineering department can't solve your problem, we will be happy to refer you to someone who can from our extensive list of customers and vendors.
Kadco Ceramics has been a leading supplier of diamond machining services since its founding in 1980. We specialize in unique solutions to requirements for shaping hard materials for commercial, military, medical and educational institutions. We have developed techniques for machining:
* metal oxides, nitrides and carbides including alumina, zirconia, aluminum nitride and silicon carbide
* composites such as glass or ceramic filled plastics and layered structures
* hard metals such as tungsten
* silicon in wafer and bulk form
* piezo ceramics such as PZT, barium titanate and other ferroelectric ceramics
* quartz, sapphire and other optical materials
We are constantly looking for new challenges for precision machining of ceramics from our expanding list of customers